PCB Width: L500 - W400mm
Quantity of cooling zones: 3(top 3/bottom 3)
PC + Siemens PLC control system
 Homogenous heat transfer |
Heating System -- Reproducible temperature profile. -- Outstanding process stability with the smallest possible ΔT -- Homogenous heat input over the entire PCB thanks to specially designed nozzles. -- Low maintenance effort. |
Vacuum System:
-- Independent transmission vacuum system
-- Ensure the reduction of bubble rate
-- Efficient production cycle time
-- Larger PCB size
| Effective Residue Management As is the case with all industrial processes,substances are generated during SMT production which have to be removed from the process cycle because they contaminate the system. Our highly effective residue management function purifies the process gas safely and reliably, and keeps your system clean and dry. |
Cooling System Stress-free cooling using individually adjustable ventilators Gentle cooling through extended cooling tract Flexible combination possibilities through a range of different options New, sustainable cooling principle as a result of liquid nitrogen cooling. |
Vacuum Reflow Soldering for Automotive Electronics
| LV Series Vacuum Reflow Oven |
I.C.T-LV733 |
I.C.T-LV733N |
| Length of heating zones |
3730mm |
|
| Quantity of preheating zones |
9 | |
| Length of preheating zones |
3450mm |
|
| Quantity of peak zones |
1 | |
| Quantity of cooling zones |
3[top 3(Water cooling)/bottom 3(Air cooling)] |
|
| Length of cooling zones |
1460mm |
|
| PCB Size |
L320 - W400mm |
|
| |
|
|
| Weight |
ca. 2500 kg |
ca. 2800 kg |
More detials please Contact Us>> or email to info@smt11.com
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