I.C.T LV Vacuum Reflow Oven | Advanced Soldering Technology

Discover the I.C.T LV Vacuum Reflow Oven in our latest video, highlighting its key advantages for superior soldering performance. This innovative system is designed to enhance your manufacturing process with features that include:

• High-Quality Soldering: The vacuum module effectively removes solder voids, improving mechanical, electrical, and thermal properties for enhanced reliability. Nitrogen integration is also supported.
• Track Upgrade: The innovative track design prevents PCB jamming and deformation, allowing independent control of each section’s speed for improved stability and flexible width adjustments.
• Stable Temperature and Powerful Cooling: Uniform heating ensures even temperature distribution, while dual cooling (forced air and water) prevents heat leakage and saves energy.
• Enhanced Safety and Monitoring: Features MES system compatibility, real-time temperature monitoring, and advanced safety measures like hydraulic lifting and power outage protection.
• Easier Maintenance: Dual flux recovery systems simplify maintenance for convenience.