High speed FUJI Chip Shooter Machine
❙ Features of FUJI Chip Shooter
SMT production line machine FUJI placement, high speed FUJI chip shooter, supporting any kind of production.
The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips per hour. The NXT III supports the smallest parts being used in mass production with extreme placing accuracy.
A faster XY robot and faster tape feeders, as well as a newly developed "flying vision" parts camera, mean increased placing ability for all part sizes and types.
The new H24G high-speed head achieves 37,500 cph (chips per hour) (Productivity priority mode) per module, a 44% improvement from the fastest speed of the NXT II.
1. 0201 mm Part Support, +/- 0.025 mm Placing Accuracy
As well as supporting the smallest parts currently being used in mass production (0402 mm, 01005"), the NXT III can also handle the next generation of components heading for the market - 0201 mm parts.
By improving machine rigidity and further refining its independent servo control and vision recognition technology, Fuji has achieved a placing accuracy for small chip parts of +/- 0.025 mm* (3sigma, Cpk≥1.00).
* Under conditions at Fuji.
2. Improved Usability
The GUI of the original NXT was widely praised for making use of intuitive and easy-to-understand pictograms instead of relying on language-based instructions.
This interface is now combined with a touchscreen panel to make operation even easier. This reduces the number of button pushes required and makes selecting commands easier, as well as improving quality by reducing the chance of performing the wrong command.
3. High Compatibility
Many of the main units from the NXT II such as placing heads, nozzle stations, feeders, tray units, and feeder pallet exchange units can be used on the NXT III without any modifications.
❙ Specification of FUJI Chip Shooter
Item |
M3 III |
M6 III |
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Applicable PCB size (LxW) |
48 x 48 mm to 250 x 510 mm (double conveyor)* 48 x 48 mm to 250 x 610 mm (single conveyor) *Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode. |
48 x 48 mm to 534 x 510 mm (double conveyor)* 48 x 48 mm to 534 x 610 mm (single conveyor) *Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode. |
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Part types |
Up to 20 types of parts (calculated using 8 mm tape) |
Up to 45 types of parts (calculated using 8 mm tape) | ||||||||||||||||||||||||||||||||
PCB loading time |
For double conveyor: 0 sec (continuous operation) For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules) |
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Placement accuracy (Fiducial mark standard) * The placing accuracy is obtained from tests conducted by Fuji. |
H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00 V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00 H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00 H08/H04 : +/-0.050 mm (3sigma) cpk≥1.00 H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00 H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00 GL : +/-0.100 mm (3sigma) cpk≥1.00 |
H24G : +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00 V12/H12HS : +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00 H08M/H04S/H04SF : +/-0.040 mm (3sigma) cpk≥1.00 H08/H04/OF : +/-0.050 mm (3sigma) cpk≥1.00 H02/H01/G04 : +/-0.030 mm (3sigma) cpk≥1.00 H02F/G04F : +/-0.025 mm (3sigma) cpk≥1.00 GL : +/-0.100 mm (3sigma) cpk≥1.00 |
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Productivity * The throughput above is based on tests conducted at Fuji. |
H24G : 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode) V12 : 26,000 cph H12HS : 24,500 cph H08 : 11,500 cph H04 : 6,500 cph H04S : 9,500 cph H04SF : 10,500 cph H02 : 5,500 cph H02F : 6,700 cph H01 : 4,200 cph G04 : 7,500 cph G04F : 7,500 cph GL : 16,363 dph (0.22 sec/dot) |
H24G : 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode) V12 : 26,000 cph H12HS : 24,500 cph H08M : 13,000 cph H08 : 11,500 cph H04 : 6,500 cph H04S : 9,500 cph H04SF : 10,500 cph H02 : 5,500 cph H02F : 6,700 cph H01 : 4,200 cph G04 : 7,500 cph G04F : 7,500 cph 0F : 3,000 cph GL : 16,363 dph (0.22 sec/dot) |
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Supported parts |
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Module width |
320 mm |
645 mm |
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Machine dimensions |
L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III) W: 1900.2 mm, H: 1476 mm |
DynaHead(DX) |
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Nozzle quantity | 12 | 4 | 1 | |
Throughput(cph) |
25,000 Parts presence function ON: 25,000 |
11000 | 4700 | |
Part size (mm) |
0402 (01005") to 7.5 x 7.5 Height:Up to 3.0 mm |
1608 (0603")to 15 x 15 Height:Up to 6.5 mm |
1608 (0603")to 74 x 74 (32 x 100) Height:Up to 25.4 mm |
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Placing accuracy (Fiducial mark based referencing) |
+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00* *+/-0.038 mm obtained with rectangular chip placement (high accuracy tuning) under optimal conditions at Fuji. |
+/-0.040 mm (3σ) cpk≥1.00 |
+/-0.030 mm (3σ) cpk≥1.00 |
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Part presence check |
o |
x |
o |
|
Parts supply |
Tape |
o |
o |
o |
Stick |
x |
o |
o |
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Tray |
x |
o |
o |
Parts supply system |
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lntelligent feeders |
Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape |
Stick feeders |
4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm) |
Trays |
Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M),276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC) |
Options | |
Tray feeders, PCU II (Pallet Change Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Nexim Software |
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❙ FUJI Chip Shooter Machine Video