The Lead Free Wave Soldering Machine DIP Line
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Introduce of DIP Wave Soldering Machine
1.Nozzle: Japan Kuroda Seiko nozzles, adjustable atomizing area, ensuring the long time spray uniformity and reliability.
2.Spray control: computer control or manually adjust switch, precise control the spray time, spray speed, economy and environmental protection, digital FLUX flow, spray flow, angle, density, width and other parameters can be recorded.
3.Cleaning device: automatic cleaning, modular design, easy maintenance.
4.Temperature Protection: third-party over-temperature protection, multiple protection layers to ensure safe operation.
5.Products comply with CE, CCC, UL and other standards and specifications.
6.User-friendly design: fault detection (such as heaters abnormal alarm, etc.), regular maintenance reminders, economy functions, emergency manual transmission function and tool-free maintenance, reduce equipment failure rates.
7.Heating module: horizontal reflow design makes each heating zones not influenced by adjacent zones to ensure accurate temperature curve, while ensuring high production capacity and heat exchange capacity, and achieve high adaptive capacity (to meet the soldering of automotive electronics, communications, electronics, computers and mobile phones, and other consumer electronics.).
8.Moving parts: Computer adjustment, stepper motor control, accuracy and stability, to ensure accurate spray.
9.Temperature control: PLC + PID independent temperature control, real-time monitoring preheat temperature.
10.Core components: using imported components to ensure long-term stability of equipment operation, reduced maintenance costs. 11.Can choose different configurations of flux processing system, to ensure the furnace hall clean.
12.Closed-loop transmission speed control systems, transportation control accuracy ± 2mm / min, ensuring speed more stable.
13.Dross Collection: Automatic dross return channel,the most energy-efficient channel design.
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Specification of DIP Wave Soldering Machine
|
Model
|
W4
|
W3
|
W2
|
|
Dimension:(mm)
|
4200X1250X1500
|
3600X1250X1500
|
2900X1160X1500
|
|
Weight(kg)
|
Approx.1500kg
|
Approx.1200kg
|
Approx.790kg
|
|
Power Supply
|
3P5W,380/220V 50Hz
|
3P5W,380/220V 50Hz
|
3P5W,380/220V 50Hz
|
|
Startup Power
|
32kw
|
24kw
|
16kw
|
|
Operation Power
|
12kw
|
9kw
|
7kw
|
|
Control System
|
PLC
|
|
Spray System
|
|
Transmission Method
|
Step motor
|
|
Spray Pressure
|
0.25Mpa--0.4Mpa
|
|
lux flow
|
10--100ml/min
|
|
Exhaust Diameter
|
Φ200mm
|
|
Exhaust Capacity
|
25m3/min
|
|
Preheating System
|
|
Preheating Mode
|
Hot air
|
|
Control Mode
|
PID + SSR
|
|
Preheating Zone
|
4
|
3
|
2
|
|
Preheating Length
|
1800mm
|
1600mm
|
1200mm
|
|
Preheating Temp.
|
(Room Temperature)-250°C
|
|
Warm-up Time(min)
|
Approx.15min (setting 150°C)
|
|
Conveyor System
|
|
PCB Size:LxW(mm)
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Min:80x60mm; Max:400x300mm
|
|
Conveyor Speed
|
0-2000(mm/min)
|
|
Conveyor Height
|
750+/-20 (mm)
|
|
Finger
|
Double hook claw (Standard)
|
|
Conveyor width control
|
Manually
|
|
Conveyor Angle
|
4~7degree
|
|
Soldering System
|
|
Solder Pot style
|
Mechanical
Motor drive
|
|
Solder Pot Material
|
Full Titanium (Standard FT)
|
|
Solder pot temperature
|
300°C
|
|
Solder pot capacity
|
Lead-free 350kg
|
Lead-free 300kg
|
Lead-free 250kg
|
|
Other
|
|
Finger cleaning system
|
Brush
|
